Optimization of Interconnect Geometrical Parameters to Enhance the Performance of Sub Threshold Circuits

S. D. Pable, S. S. Chopade

Abstract


Sub threshold circuits are shown to be the best candidatefor satisfying the ultra low power demand of battery operatedsystems having moderate throughput. However, exponential increasein driver resistance in sub threshold region and increasedinterconnect capacitance due to technology scaling will become amajor hurdle in improving the speed of sub threshold interconnects.Improving the speed of such low power circuits is a major designchallenge in ultra low power domain. This paper presentsacomprehensive analysis of Cu, SWCNT and mixed CNT bundleinterconnects and investigates their performance in terms of energyand delay for future sub threshold circuits. This paper mainlycontributes towards optimizing the geometrical parameters ofinterconnect (aspect ratio scaling) specially for sub threshold circuitsto increase their speed. Crosstalk analysis has also been carried outwith the proposed interconnect geometry parameters. It has beenfound that the optimized interconnect reduces the interconnect delayand switching energy significantly. 

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